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Advantages of using Chip Embedding over discrete package solutions – KBA238173

Advantages of using Chip Embedding over discrete package solutions – KBA238173

Infineon_Team
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To meet higher requirements on power density, efficiency, reliability and cost reduction, Infineon proposes its Chip Embedding S-cells technology where the power discrete packages are no longer soldered on the PCB. Instead, they are embedded inside the PCB. This solution is called “Chip Embedding” technology.

The Chip Embedding technology offers several key advantages over discrete packages:

Category

Parameters

Advantages of Chip Embedding over
Discrete package solution

Power stage

On state resistance (RDS(ON))

Lower by 25–35%

Thermal resistance (Rth)

Lower by 45–50%

Thermal impedance (Zth)

Lower by 30–40%

Parasitic inductance (L)

Lower by 50–70%

Drain current (I_drain)

Higher by 55–60%

Power capability

Higher by 35–40%

Switching transients

Reduced significantly

Efficiency

Improved significantly

System interconnect

Loop resistance and inductance

Reduced

Compact design

Improved

Quality

Reliability

Improved

Thermal performance

Improved

 

Note: The values provided are based on a 48 V system and may vary in different test conditions.

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