IGBT Forum Discussions
You. Obtained from EVAL-IHW65R62EDS06J and 2ED2182S06F boards.
I followed the instructions in the linkto connect the card in a laboratory environment. The induction coil we use is a standard coil with a value of 65uh and a diameter of 17cm. There is a 1 cm gap between the cookware and the coil that we have placed.
Using the schematic I shared, I connected the EVAL-IHW65R62EDS06J card to the pins 8-HIN, 3-LIN, and 2-GND pins of the X4 to generate and STM32G031F8P6 40KHZ PWM and 4000ns dead time. (Figure 1)
I encountered some problems
The STM32G031F8P6 MCU may reset when the EVAL-IHW65R62EDS06J board begins to consume power, i.e. the cookware is placed in the induction coil.
Placing the cooking pot on the induction coil will cause the STM32G031F8P6 MCU to reset or become unresponsive after the system has been running for a while.
To solve these problems, a circuit was added to isolate the STM32G031F8P6 MCU board and the EVAL-IHW65R62EDS06J board from each other (Figure 2).
The problem here is that the T1-T2 IGBT (IHW40N65R6) with EVAL-IHW65R62EDS06J fails 10-30 seconds after the card starts working.
Show Less在英飞凌 IPOSIM应用笔记《Dimensioning program IPOSIM for loss and thermal calculation of Infineon IGBT modules》中,请问图片2 、图片3中公式是如何推导出的或从何处引用?
Hello!
My name is Junior and I am carrying out a simulation in the Plecs software that reports errors that may originate from the values entered in the parameters of each semiconductor switch. Therefore, I attached the datasheets to this question and would like someone's help to fill in the values for each key.
1) In IGBTs I need to fill in values in the fields in the figure below:
2) In IGBTs I need to fill in values in the fields in the figure below:
3) In the body diodes, I need to fill in the fields in the figure below with values:
4) In the body diodes, I need to fill in the fields in the figure below with values:
5) For diodes that operate alone, I need to fill in the fields in the figure below with values:
6) For diodes that operate alone, I need to fill in the fields in the figure below with values:
Thank you very much for any help that can be provided.
Best Regards.
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Could you please answer the following question we received via social media?
Question: What is the use this module?
Thank you
Hi
Please can some IGBT Gurus clarify the trouble I am struggling since a while?
I thought I can find the solution here in manufacturer site hopefully.
I have bunch of same type IGBT Modules 1200V 75A type for repairing work.
Once triggered with a Vge of 12V and then Vge source removed(gate floating, electrrically open), group of them keep conducting till Vds removal, while the other group goes OFF slowly in 3-4seconds just after Vge removal.
With Vge signal connected, they can be set ON and OFF state as expected.
Which is behaving correctly, can someone please clarify that strange behaviour please.
The rest of all readings are identical.
Thanks.
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Hello,
We are facing some problems with our inverter circuits using the IGCM10F60GA and IGCM15F60GA modules. Both modules appear to burn on the exact same spot, as you can see at the pictures below. When this occurs, the shunt resistor too always blows (we are using the 1-shunt application).
Could you tell us please wich parts of the module circuit (eg.: the boostrap section, or the logical section of the module) is located at this region that blows up? It will be of great help to us finding what is wrong with our application.
Of nearly 400 inverters we built as of today, we are talking about 60 failures, wich we consider totally abnormal. When we analyse the damaged modules, usually the low side of two legs is short-circuited between the respective N power pins (eg: U shortened to NU, W to NW). Sometimes the high side is shortened too (when this occurs the damage to the board is impressive).
The power circuit is shown below. We drive a 1/2hp 3-phase motor using the inverter circuit. The C77 and C78 are capacitor arrays (1nF as suggested in the AN2016-11). The power rating of the shunt resistor is 10W.
Here you can see the damage on four different samples of damaged modules. The module "explodes" always on the same spot.
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Dear Infineon partners,
For IKW75N65ES5 ,Information related to wafers(Production location、shelf life etc. )
Need your help to urgent support~
Thank you so much!
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想要咨询一下英飞凌FF600R12KE4的热阻测试,为什么RthJC标最大值,RthCH标典型值?以及我们测试是按单芯片测试还是按半桥测试?