IGBT Forum Discussions
Hello. The AN2019-10 and AN2018-23 application notes have Inverter welding schematics which do not indicate the IC part number for driving IGBT gates. Could you kindly assist with the IC part number?
Show LessHello to All,
I would like to ask Infenion Application Engineers about the PFC Inductor in that EVAL board:
https://www.infineon.com/cms/en/product/evaluation-boards/eval-pfc5kikwwr5sys/
We tried to copy that design for our PFC needs. It actually worked very well with almost all exact components. The problem is I am not so capable on inductors and I tried a couple of inductor with product number but they couldn't do well.
So, we decided to have custom made toroid inductor as you did on reference design. Can someone give extra information about core of the inductor.
Supplier of the core is probably that company:
http://pocomagnetic.com/en/product/index94.html
So, I need to learn about inductor design and my managers don't want to take risk of design an inductor from the beginning.
Can we somehow buy that inductor? Or can we buy core at least?
Thanks.
Show LessThe IGBT junction or case temperature is calculated with Foster model, the input parameters are power losses, thermal data, et al. The loss and temperature under a single power point is easy to calculate. But, how to calculate the power loss and temperatures based on a year power mission profiles? There are too many power points in a year power mission profiles. The simulation from plecs is impracticable.
like in the figure, the steps of power calculation and thermal calculation is puzzled.
# junction and case temperature
# reliability
# Lifetime Estimation
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Hi,
We are currently trying to reduce the switching losses of a FS200R12KT4R IGBT module, to increase the power level of a 3 phase 2-level inverter. The application data are: 675 Vdc, 75 Arms inverter current, 115 Vrms output voltage (3-phase), fsw = 10800 Hz. We use the "1ed3323mc12n" eicedriver as a gate driver with a 1 W DC/DC power supply for each IGBT, and supply the IGBT with +16: -8 V.
Generally we have tried to follow good practices when designing the PCB layout e.g. minimising the gate loop and the commutation loop with a close connection to the film capactitor DC link and by using a DC link decoupling snubber film capacitor.
To reduce the switching losses we are decreasing the gate resistance. We started from 10 ohm to 5 ohm, where the measured IGBT case temperature dropped 16 degree celsius. Now we reduced the gate resistance to 2.5 ohm and expected a further improvement (at least according to IPOSIM), but we get the same case temperature as with 5 ohm, without any improvement at all. It seems like we reached a limit of possible reduction in swithing losses. We have measured the gate driver voltage supplies to make sure they are operating correctly and could not find any issues. We also measured the collector-emitter voltage and gate-emitter voltage, and could also not see any issues.
So we are looking for ideas of how to troubleshoot, to be able to reduce the switching losses even further. We are aware that pcb layout and connections can be limiting the performance through parasitic elements, but could this be the cause and how do we test that ? Or is there something we have overlooked ?
Thanks in advance.
Show LessI am designing a circuit to drive an igbt using 1ED3890MC12M.
Problem is when I first connect driver to pcb, I could connect to it for couple seconds. After that, it starts to pull excess current and it increases over time until something is burned.
I also tried to connect only GND, 3.3V+, SCL, SDA, Vin pins to an Arduino just to check if there is wrong with my PCB design.
However, same problem occurs even with only those 5 pins are connected to Arduino.
Also, I realized that as short circuit current drop increases, value of the 40K resistor in the 1ED3890 between Vin and GND decreases.
Could find related documents in the attachment.
Thank you for you time,
Berkay Gursoy
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Hi Dears, I have a Hitex Hybridkit DSC and I want to run vector control with that. I want to use 3 hall effect sensors as the position sensor but it's logic board have encoder input only. Do anyone have solution to connect Hall effect sensors to logic board v3.3 directly?
Show LessHello, regarding the IGBT product of the FF600R12ME4 model, I am conducting a double pulse test and found that adding a Snubber capacitor between the capacitor busbar and the IGBT driver reduces the peak of the lower tube Vce, but Ic also exhibits significant oscillations. As shown in the figure below, the yellow channel represents the lower tube Vge, the green channel represents the Ic current, and the red channel represents the lower tube Vce. May I ask if there is a way to reduce the oscillation of Ic.
Show Less
The IGBT junction or case temperature is calculated with Foster model, the input parameters are power losses, thermal data, et al. The loss and temperature under a single power point is easy to calculate. But, how to calculate the power loss and temperatures based on a year power mission profiles? There are too many power points in a year power mission profiles. The simulation from plecs is impracticable.
like in the figure, the steps of power calculation and thermal calculation is puzzled.
# junction and case temperature
# reliability
# Lifetime Estimation
Show Less
Hello,