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Gate Driver ICs Forum Discussions

Greg1
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We are planning on using the 2ED2110S06M Gate driver IC at higher switching frequencies. Because of this, we are concerned about power dissipation of the 16-lead wide body SO surface mount package. There are a number of "unused" pins (4, 5, 9, 10 and 16) in this IC package, so we are wondering if connecting them to some sort of copper pour pad under and around the IC might be helpful to improve the IC power dissipation (presently we have a land for each pin but noting connected to any of them.)

Can or should the unused pins of 2ED2110S06M Gate driver IC be electrically connected together or connected to an electrical plane like GND or VSS?

Are the 2ED2110S06M unused pins in good thermal contact with the lead-frame the die is mounted on inside the package?

Do you have a recommended "heat dissipating" component land pattern or layout tips for using the gate drivers in the SO-16 package at higher frequency/higher power dissipation?

Thank You for you help!

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1 Solution
AZIZ_HASSAN
Moderator
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Moderator

Hi,

Thank you for posting on Infineon community and I would like to answer your query point wise.

1) Since, you are using the IC at higher switching frequency, there will be higher switching loss. 

2) The best way to handle the unused pins is to connect them to the ground rather then keep them floating. Yes, you can connect them all together and connect to common ground but make sure there is no or minimum ground loop in order to avoid any ground noise (if any, normally there wont be any noise due to fixed ground connection) . Another way is that you connect the unused pins to the ground separately which is basic and normally used.

3) Yes, all the pins of the IC are connected to die in order to have same  thermal resistance through out the surface which tends to uniform lateral heat transfer across the body.

4) If the junction temperature is crossing the limit given in the data sheet then, you can use copper pads(it depends upon what copper grade is used like TG150 etc and what is PCB material like FR4 or any other) on the PCB to make the heat dissipation more efficiently. This methods is generally used for SMD components and you can use it for your application as well.

As per the power loss and heat dissipation, you can choose what copper area is needed even if after providing  the copper area, if temperature increase is more, you can provide some air vents in the copper area of the PCB for better  heat convection.

5) There are some other options like thermal pads available  which can be used for the application but they act as thermal insulators as well. So, if you opt for this better check the compatibility properly.

If you need any further design help please let me know.

BR,

AZIZ HASSAN

 

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3 Replies
AZIZ_HASSAN
Moderator
Moderator 100 sign-ins 50 solutions authored 10 likes received
Moderator

Hi,

Thank you for posting on Infineon community and I would like to answer your query point wise.

1) Since, you are using the IC at higher switching frequency, there will be higher switching loss. 

2) The best way to handle the unused pins is to connect them to the ground rather then keep them floating. Yes, you can connect them all together and connect to common ground but make sure there is no or minimum ground loop in order to avoid any ground noise (if any, normally there wont be any noise due to fixed ground connection) . Another way is that you connect the unused pins to the ground separately which is basic and normally used.

3) Yes, all the pins of the IC are connected to die in order to have same  thermal resistance through out the surface which tends to uniform lateral heat transfer across the body.

4) If the junction temperature is crossing the limit given in the data sheet then, you can use copper pads(it depends upon what copper grade is used like TG150 etc and what is PCB material like FR4 or any other) on the PCB to make the heat dissipation more efficiently. This methods is generally used for SMD components and you can use it for your application as well.

As per the power loss and heat dissipation, you can choose what copper area is needed even if after providing  the copper area, if temperature increase is more, you can provide some air vents in the copper area of the PCB for better  heat convection.

5) There are some other options like thermal pads available  which can be used for the application but they act as thermal insulators as well. So, if you opt for this better check the compatibility properly.

If you need any further design help please let me know.

BR,

AZIZ HASSAN

 

Greg1
Level 1
First reply posted First question asked First like given
Level 1

Thank you for thoroughly answering our questions, we appreciate it.

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AZIZ_HASSAN
Moderator
Moderator 100 sign-ins 50 solutions authored 10 likes received
Moderator

Hi,

Thank you for your appreciation.

BR,

AZIZ HASSAN

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