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Hello,
The datasheet is not clear. Should the thermal pad on CY7C65630 be connected to GND?
Thanks!
Solved! Go to Solution.
- Labels:
-
CY7C65630
-
Datasheet
-
ground
-
thermal pad
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Hi,
The E-PAD(thermal pad, fins of TO-220) is generally connected to the lowest voltage handled by the device.
For example, a negative LDO should be connected to the input voltage (-Vin), and a dual-supply op amp should be connected to negative voltage(V-).
Sometimes the E-PAD is not connected inside the device just for heat dissipation.
If only the E-PAD is soldered and not connected anywhere on the board, the noise immunity will be reduced because it will be an high impedance pattern.
Therefore, I think that HX2LP should be connected to GND.
Regards,
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Hi,
The E-PAD(thermal pad, fins of TO-220) is generally connected to the lowest voltage handled by the device.
For example, a negative LDO should be connected to the input voltage (-Vin), and a dual-supply op amp should be connected to negative voltage(V-).
Sometimes the E-PAD is not connected inside the device just for heat dissipation.
If only the E-PAD is soldered and not connected anywhere on the board, the noise immunity will be reduced because it will be an high impedance pattern.
Therefore, I think that HX2LP should be connected to GND.
Regards,