HYPERAM™ 3.0 is the 3rd generation of the HYPERRAM family. The new 1.8V 256Mbit products are based on a 16-bit wide extended version of the HYPERBUS interface thereby doubling the throughput to 800 MBps, when compared to the existing generation 2.0 devices. HYPERRAM 3.0 devices are ideal for applications such as AIoT devices and factory automation applications.
The x16 256Mbit products are now available for sampling in industrial temperature (-40°C to +85°C) grade in a 49-BGA package. Refer to the attached Product Brief for more details.
