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no1001
Level 1
Level 1
First like given 10 sign-ins 5 sign-ins

I think that writing PROM during MCU manufacturing process is necessary in the backend.

However I could not find it even in the PPAP document.

Because TC234LP and TC234L have same wafer and pakage in term of hardware, programming during manufacturing is necessary as well as testing.

Therefore HSM and chip ID can be different even in same hardware.

Please, help me the MCU manufacturing flow.

 

https://www.youtube.com/watch?v=bor0qLifjz4

https://www.youtube.com/watch?v=Q5paWn7bFg4

https://www.youtube.com/watch?v=_VMYPLXnd7E

 

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MarkusNoll
Employee
Employee
10 likes received 25 sign-ins 10 solutions authored

Hi ,

 

not sure if I understood your question correctly.

But in general you are correct. I think it's quite common in general in the semiconductor industry that several marking-variants are sharing the same-silicon with various enabled/disabled functionalities.

Usually this device-specific programming is done during manufacturing during front-end or back-end testing.

In the end, the only relevant information for your application is the chip-id that specifies which exact variant you have and what functionalities are available.

 

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MarkusNoll
Employee
Employee
10 likes received 25 sign-ins 10 solutions authored

Hi ,

 

not sure if I understood your question correctly.

But in general you are correct. I think it's quite common in general in the semiconductor industry that several marking-variants are sharing the same-silicon with various enabled/disabled functionalities.

Usually this device-specific programming is done during manufacturing during front-end or back-end testing.

In the end, the only relevant information for your application is the chip-id that specifies which exact variant you have and what functionalities are available.

 

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