1. For some reason, the TC387 is assembled on the bottom of PCBA, and it will be soldered twice. In the second reflow soldering, the TC387 will be on the bottom of PCBA, is there any risk for the soldering quality?
2. If TC387 is flashed first, and then reflow soldered, will the MCUprogram be lost or bit error, or is there any other risk?
